Global and China Advanced Packaging
Industry Report, 2012-2013 covers the
followings:
- Global Semiconductor Industry
Overview;
- IC Manufacturing Industry
Overview;
- IC Downstream Industry Market
Overview;
- Advanced Packaging Industry and
Market;
- 23 Advanced Packaging Vendors
In 2012, global semiconductor sales
fell 2.7%; semiconductor equipment spending dropped by 15% to US$36.9 billion
from US$43.5 billion in 2011. The semiconductor market in 2013 is also not
optimistic, accompanied by recession of the world’s emerging economies and
Europe’s sluggish recovery. U.S. and Japanese markets are relatively better,
while China, as the world’s largest semiconductor market, has witnessed
lower-than-expected economic growth, the global economy is yet to show signs of
recovery.
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In spite of the overall decline in
semiconductor industry, the foundry field still grows. In 2012, the global
semiconductor foundry market reached total value of US$34.6 billion, an
increase of 6.5% over 2011. With the growth slowdown of smart phones and tablet
PCs, it is expected that the foundry market in 2013 will increase by just 1.6%
to exceed about US$35.2 billion.
With foundries as main customers,
advanced packaging vendors were therefore essentially flat or slightly enhanced
in 2012, the same expected in 2013. The fall in price of gold, the
indispensable raw material for advanced packaging vendors, especially LCD
Driver IC packaging companies, will improve the profit margin of advanced
packaging vendors in 2013.
Vendors located in Malaysia and
Singapore all showed decline, on account of the decreasing revenue of foundries
in this region. Taiwanese peers saw moderate growth except memory package,
chiefly benefiting from the strong drive of TSMC and UMC. South Korean
companies were boosted by Samsung.
Among Japanese companies, J-devices
experienced the highest growth, mainly owing to the back-end packaging business
purchased from Fujitsu. In January, 2013, Japan’s largest semiconductor vendor
– Renesas also sold three back-end packaging factories to J-devices, which
would usher in amazing growth in the coming year, with expected annual revenue
in FY2013 and FY2017 outnumbering JPY100 billion and JPY250 billion,
respectively.
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Taiwan-based Chipbond, the world’s
largest LCD Driver IC packaging vendor, will be another eye-catching performer
in 2013. The significantly enhanced screen resolution of mobile phone and
tablet PC will greatly raise Chipbond’s earnings, and the decline in gold
prices makes it the biggest beneficiary. In order to further improve the
industrial chain layout, Chipbond acquired the COF substrate vendor - SIMPAL
Electronics on May 2, 2013.
In addition, Chipbond is the
advanced packaging vendor with the highest operating margin, i.e. 16.7% in 2011
and 21.9% in 2012, but also the unique one with operating margin growth. ASE
closely followed in terms of operating margin, who benefitted from its large
customer TSMC that produced the world’s state-of-the-art IC.
Chinese Mainland counterparts
performed poorly, although JECT’s revenue saw substantial growth, yet its
operating margin fell sharply from 1.8% in 2011 to 0.2% in 2012, slipping to
the edge of loss.
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