Failure Analysis Equipment Market - Global Industry Analysis, Size, Share, Growth, Trends And Forecast, 2012 - 2019
Failure analysis is an engineering approach to determining how and why component or equipment has failed. The goal of a failure analysis is to understand the root cause of the failure to prevent similar failures in the future. Common causes of failure include misuse or abuse, manufacturing defects, assembly errors, improper maintenance, design errors, improper material, fastener failure, improper heat treatments, inadequate quality assurance, inadequate environmental protection/control, unforeseen operating conditions and casting discontinuities.
This market research study analyzes the failure analysis equipment market on a global level, and provides estimates in terms of revenue (USD Billion) from 2013 to 2019. It recognizes the drivers and restraints affecting the industry and analyzes their impact over the forecasted period. Moreover, it identifies the significant opportunities for market growth in the years to come.
Browse Full Report With TOC:
http://www.marketresearchreports.biz/analysis-details/failure-analysis-equipment-market-global-industry-analysis-size-share-growth-trends-and-forecast-2013-2019
The report segments the market on the basis of geography into North America, Asia Pacific (APAC), Europe, and Rest of the World (RoW), and estimated in terms of revenue (USD Billion). In addition, the report segments the market based on equipments which includes Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam Systems (FIB) and Dual Beam (FIB/SEM) Systems.
Furthermore, the report has also been segmented on the basis of end-use which includes Semiconductors Manufacturing, Fiber Optics, Bio medical and life sciences, Metallurgy, Nanotechnology and nanomaterials and Polymers. Moreover, the report segments the market based on technology which includes Focused Ion Beam (FIB), Broad Ion Milling (BIM), Secondary ion mass spectroscopy (SIMS), Energy dispersive X-ray spectroscopy (EDX), Reactive ion etching (RIE) and Chemical mechanical planarization (CMP). All these segments have also been estimated on the basis of geography in terms of revenue (USD Billion).
For better understanding of the failure analysis equipment market, we have given a detailed analysis of the value chain. Moreover, a detailed Porter’s five forces analysis has been given for a better understanding of the intensity of competition present in the market. Furthermore, the study comprises of a market attractiveness analysis, where the equipment are benchmarked based on their market scope, growth rate and general attractiveness.
The report provides company market share analysis of the various industry participants. Key players have also been profiled on the basis of company overview, financial overview, business strategies, SWOT analysis, and recent developments in the field of failure analysis equipment. Major market participants profiled in this report include FEI Company, Hitachi High-Technologies Europe GmbH, Carl Zeiss SMT GmbH and JEOL, Ltd. among others.
To Get Download Full Report with TOC: http://www.marketresearchreports.biz/sample/sample/174481
Failure analysis equipment Market: By geography
• North America
• Europe
• Asia Pacific
• Rest of the World
Failure analysis equipment Market: By equipment
• Scanning electron microscope (SEM)
• Transmission electron microscope (TEM)
• Focused Ion Beam system (FIB)
• Dual - Beam (FIB/SEM) systems
Failure analysis equipment Market: By technology
• Focused ion beam (FIB)
• Broad ion milling (BIM)
• Secondary ion mass spectroscopy (SIMS)
• Energy dispersive X-ray spectroscopy (EDX)
• Reactive ion etching (RIE)
• Chemical mechanical planarization (CMP)
Failure analysis equipment Market: By end-use
• Semiconductors manufacturing
• Fiber optics
• Bio-medical and life sciences
• Metallurgy
• Nanotechnology and nanomaterials
To Read Complete Report with TOC: http://www.marketresearchreports.biz/analysis/174481
Table of Contents
Chapter 1 Preface
1.1 Report Description
1.2 Research Scope
1.3 Research Methodology
Chapter 2 Executive Summary
Chapter 3 Market Overview
3.1 Introduction
3.2 Value chain analysis
3.3 Market Drivers
3.3.1 Growth in nanotechnology
3.3.2 Growth in medical technologies in Asia Pacific
3.3.3 Increased investments in research and education infrastructure
3.4 Market Restraints
3.4.1 Low adoption rate due to high cost of equipment
3.5 Market opportunities
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United States
State Tower
90 State Street, Suite 700
Albany, NY 12207
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Failure analysis is an engineering approach to determining how and why component or equipment has failed. The goal of a failure analysis is to understand the root cause of the failure to prevent similar failures in the future. Common causes of failure include misuse or abuse, manufacturing defects, assembly errors, improper maintenance, design errors, improper material, fastener failure, improper heat treatments, inadequate quality assurance, inadequate environmental protection/control, unforeseen operating conditions and casting discontinuities.
This market research study analyzes the failure analysis equipment market on a global level, and provides estimates in terms of revenue (USD Billion) from 2013 to 2019. It recognizes the drivers and restraints affecting the industry and analyzes their impact over the forecasted period. Moreover, it identifies the significant opportunities for market growth in the years to come.
Browse Full Report With TOC:
http://www.marketresearchreports.biz/analysis-details/failure-analysis-equipment-market-global-industry-analysis-size-share-growth-trends-and-forecast-2013-2019
The report segments the market on the basis of geography into North America, Asia Pacific (APAC), Europe, and Rest of the World (RoW), and estimated in terms of revenue (USD Billion). In addition, the report segments the market based on equipments which includes Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam Systems (FIB) and Dual Beam (FIB/SEM) Systems.
Furthermore, the report has also been segmented on the basis of end-use which includes Semiconductors Manufacturing, Fiber Optics, Bio medical and life sciences, Metallurgy, Nanotechnology and nanomaterials and Polymers. Moreover, the report segments the market based on technology which includes Focused Ion Beam (FIB), Broad Ion Milling (BIM), Secondary ion mass spectroscopy (SIMS), Energy dispersive X-ray spectroscopy (EDX), Reactive ion etching (RIE) and Chemical mechanical planarization (CMP). All these segments have also been estimated on the basis of geography in terms of revenue (USD Billion).
For better understanding of the failure analysis equipment market, we have given a detailed analysis of the value chain. Moreover, a detailed Porter’s five forces analysis has been given for a better understanding of the intensity of competition present in the market. Furthermore, the study comprises of a market attractiveness analysis, where the equipment are benchmarked based on their market scope, growth rate and general attractiveness.
The report provides company market share analysis of the various industry participants. Key players have also been profiled on the basis of company overview, financial overview, business strategies, SWOT analysis, and recent developments in the field of failure analysis equipment. Major market participants profiled in this report include FEI Company, Hitachi High-Technologies Europe GmbH, Carl Zeiss SMT GmbH and JEOL, Ltd. among others.
To Get Download Full Report with TOC: http://www.marketresearchreports.biz/sample/sample/174481
Failure analysis equipment Market: By geography
• North America
• Europe
• Asia Pacific
• Rest of the World
Failure analysis equipment Market: By equipment
• Scanning electron microscope (SEM)
• Transmission electron microscope (TEM)
• Focused Ion Beam system (FIB)
• Dual - Beam (FIB/SEM) systems
Failure analysis equipment Market: By technology
• Focused ion beam (FIB)
• Broad ion milling (BIM)
• Secondary ion mass spectroscopy (SIMS)
• Energy dispersive X-ray spectroscopy (EDX)
• Reactive ion etching (RIE)
• Chemical mechanical planarization (CMP)
Failure analysis equipment Market: By end-use
• Semiconductors manufacturing
• Fiber optics
• Bio-medical and life sciences
• Metallurgy
• Nanotechnology and nanomaterials
To Read Complete Report with TOC: http://www.marketresearchreports.biz/analysis/174481
Table of Contents
Chapter 1 Preface
1.1 Report Description
1.2 Research Scope
1.3 Research Methodology
Chapter 2 Executive Summary
Chapter 3 Market Overview
3.1 Introduction
3.2 Value chain analysis
3.3 Market Drivers
3.3.1 Growth in nanotechnology
3.3.2 Growth in medical technologies in Asia Pacific
3.3.3 Increased investments in research and education infrastructure
3.4 Market Restraints
3.4.1 Low adoption rate due to high cost of equipment
3.5 Market opportunities
Contact US:
United States
State Tower
90 State Street, Suite 700
Albany, NY 12207
Tel: +1-518-618-1030
E: sales@marketresearchreports.biz
Blog: http://industryresearchnews.wordpress.com/
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