Research Scope
This research focuses on motherboards, which can be dividedby CPU connector
type into socket 478, LGA775/1366/1155/1156, socket AM2/AM3, FT1, FM1, and
others.Companies surveyed are the major global motherboard makersoperating ODM,
OEM, EMS, CEM, and OBM businesses;production sites and shipment destinations
include Taiwan,China, Japan, other Asian Countries, North America, LatinAmerica,
Western Europe and other European countries, andother regions.
Product Definitions
Motherboard
Designed differently according to
intended function,motherboards are essentially comprised of soldered
integratedcircuits on PCB (Printed Circuit Board), which execute
computeroperation and control peripherals. Motherboards are notequipped with
CPU or DRAM (Dynamic Random AccessMemory) at time of shipment. During recent
years, there havebeen products with CPU or DRAM directly soldered on the PCBand
operates in the same way similar to that of motherboards,which are also
included in this research.
CPU Connector Type
Socket 478
Intel CPU with FSB of 333MHz, 400MHz, and 800MHz, 478 pins
Socket AM2
AMD K8 and K10 core CPU, 64-bit support with integratedDDRII memory controller,
940 Pins, AM2+ is included (AM2and AM2+ is compatible)
Socket AM3
AMD K10 core CPU, 64-bit support with integrated DDR3memory controller, 938
Pins. (AM3 and AM2+ is compatible)
The Worldwide Motherboard Industry
LGA 775
Intel Prescott, Cedar Mill, Presler, Conroe, Kentsfield core CPU,FSB of 533MHz
- 1333MHz
LGA 1366
Intel Nehalem microarchiecture CPU, 64 bit support withintegrated DDRIII memory
controller; change from FSB to QPI.
LGA 1155
Intel dual-core and quad-core 32nm Sandy Bridge platform CPUreleased in the
first quarter of 2011 with 1155 pins. With GPUembedded in the CPU, the
corresponding chipsets support onlyDDR3 memory
LGA 1156
LGA 1156 includes the dual-core and quad-core 45nm Lynnfieldplatform CPUs
released in the third quarter of 2009 and 32nmClarkdale platform CPU released
in the first quarter of 2010.With 1,156 pins, the CPU is embedded with GPU and
thecorresponding chipsets support only DDR3 memory
Socket FM1/FT1
AMD APU core CPU, 64-bit support with integrated DDRmemory controller and
graphics chipsets.
Others
Includes Intel socket 370, Socket A, VIA C3 and C7, as well asCPU on
Motherboard, for example, Atom.
The Worldwide Motherboard Industry
Business Type Definitions
OEM
OEM (Original Equipment Manufacturing) entails productionand assembly within
customer-specified parameters andaccording to product specifications designated
by the customer.The manufacturer does not participate in customer
activitiesrelated to product conception, branding, sales, or logistics.
EMS/CEM
EMS (Electronics Manufacturing
Service) entails production andassembly within customer-specified parameters
and accordingto product specifications designated by the customer.Additionally,
the manufacturer provides after-sales services.The manufacturer does not
participate in customer activitiesrelated to product conception, branding, or
sales. The CEM(Contract Electronics Manufacturing) business model is similarto
EMS, however, CEM focuses on sub-assembly rather thancomplete product
manufacturing and after-sales services.
OBM
OBM (Own Brand Manufacturing) entails the oversight ofproduct conception,
production, branding, sales, and logisticsactivities by manufacturers
themselves. Any goods shipped tocustomers carry the brand of the manufacturer.
Private Label
Private label entails product conception, design, and productionby
manufacturers. Customers affix their own brand and handlebranding, sales, and
logistics activities. In the PC industrycustomers within the private label
business model are typicallyreferred to as clone or white box makers, most of
which areregional channel players or system integrators. In thecommunications
industry, such customers are usually brand-name telecoms, channel players, or
system integrators.
Latest Report:
2012 was a turning point year for
the global Smartphone industry as it witnessed the rise of the Chinese market,
the boom of Android platform products, and the declines of Nokia and RIM
Smartphones. In 2013, it is anticipated that the situation will remain the same
except Smartphone coverage is to rapidly expand to emerging markets and the
non-top three venders' volume rankings are expected to see significant
changes. This report profiles the Smartphone industry, ASP (Average
Selling Price) and OS (Operating System) development based on the major changes
happened in the global Smartphone market; examines the key factors that have
led to changes in global market landscape and their impacts on the Taiwanese
mobile phone industry.