New Study On The Worldwide Motherboard Application IC Market, 1Q 2013

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 Description

This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. This report finds that the industry's shipment volume saw sequential and year-on-year declines in the fourth quarter of 2012. While the LGA775 remained the dominant CPU connector type, it is observed that Socket 1155 has been growing steadily in recent quarters. Due to a weak market demand and vendors' anticipation for new platform launch, it is projected that the worldwide motherboard shipment volume will have continued to drop sequentially in the first quarter of 2013, but will regain its growth momentum since the second quarter. 

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Table of Contents

Worldwide Motherboard Shipment Volume, 1Q 2011 - 4Q 2013Worldwide Motherboard Shipment Volume by CPU Supplier, 1Q 2011 - 4Q 2012Worldwide Motherboard Shipment Share by CPU Supplier, 1Q 2011 - 4Q 2012Worldwide Motherboard Shipment Volume by CPU Connector Type, 1Q 2011 - 4Q 2012Worldwide Motherboard Shipment Share by CPU Connector Type, 1Q 2011 - 4Q 2012Worldwide Motherboard Shipment Volume by Chipset Supplier, 1Q 2011 - 4Q 2012Worldwide Motherboard Shipment Share by Chipset Supplier, 1Q 2011 - 4Q 2012Worldwide Motherboard Shipment Volume by Chipset Type, 1Q 2011 - 4Q 2012Worldwide Motherboard Shipment Share by Chipset Type, 1Q 2011 - 4Q 2012Intelligence InsightResearch Scope & Definitions  

 

 

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